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Recommended | Not Recommended | |
Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
Hotend | All Size / Material | / |
Glue | Glue Stick | Bambu Liquid Glue |
Drying Settings before Printing | 80 °C,8h |
Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
Nozzle Temperature | 260 - 280 °C |
Bed Temperature (with PVP Glue) | 90 - 110 °C |
Printing Speed | < 300 mm/s |
Density | 1.20 g/cm³ |
Vicar Softening Temperature | 119 °C |
Heat Deflection Temperature | 117 °C |
Melting Temperature | 228 °C |
Melt Index | 32.2 ± 2.9 g/10 min |
Tensile Strength | 62 ± 2 MPa |
Breaking Elongation Rate | 3.8 ± 0.3 % |
Bending Modulus | 2310 ± 70 MPa |
Bending Strength | 108 ± 4 MPa |
Impact Strength | 34.8 ± 2.1 kJ/m² |
Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
Filament*1 & Desiccant*1
Instructions*1 & Spool Sticker*1
Package*1
Filament Label*1