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Recommended | Not Recommended | |
Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
Hotend | All Size / Material | / |
Glue | Bambu Liquid Glue Glue Stick | / |
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
Drying Settings (Blast Drying Oven) | 80 °C,8 h |
Printing and Keeping Container's Humidity | < 20% RH (Sealed,with Desiccant) |
Nozzle Temperature | 240 - 270 °C |
Bed Temperature (with PVP Glue) | 80 - 100 °C |
Printing Speed | < 300 mm/s |
Density | 1.05 g/cm³ |
Vicar Softening Temperature | 94 °C |
Heat Deflection Temperature | 87 °C |
Melting Temperature | 200 °C |
Melt Index | 34.2 ± 3.8 g/10 min |
Tensile Strength | 41 ± 1 MPa |
Breaking Elongation Rate | 10.5 ± 1.0 % |
Bending Modulus | 1880 ± 110 MPa |
Bending Strength | 68 ± 3 MPa |
Impact Strength | 39 ± 3.6 kJ/m |
Pungent and unpleasant odors may be released during printing. Make sure your printer is placed in a well-ventilated area.
Filament*1 & Desiccant*1
Instructions*1 & Spool Sticker*1
Package*1
Filament Label*1